Advanced Thermal Technology for High Heat Flux Chip Cooling
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Power Engineering and Engineering Thermophysics
Background:
Driven by carbon peak and neutrality targets, energy saving of data centers, super-fast charging of electric vehicles, and comprehensive utilization of renewable energy such as PV will be key directions of technical development in the future. The PUE of next-generation data centers will decrease towards 1.0 or lower. The output power of smart charging facilities and PV inverters will reach the MW level, and the heat flux density of chips will reach 1000 W/cm2. Heat will be a big challenge. Advanced thermal technologies should be used to achieve low thermal resistance from dies to systems.
Challenges:
1. Explore microscale design methods for high thermal conductivity films and composite material to dissipate heat from high-performance chips. 2. Develop high-performance and efficient cold plates using innovative heat transfer and flow structures, materials, and processes to improve liquid cooling performance. 3. Develop technologies for two-phase heat transfer of high limit, low temperature difference, and long distance (direct or indirect cooling), including working principles, structures, materials, and processes related to two-phase heat transfer, temperature equalization, and fluid transport, to dissipate heat from high-density chips (200–1000 W/cm2) in a small space. 4. Optimize the design of efficient cooling systems and enable intelligent control. Research the mechanisms of efficient vapor-liquid separation, flow control, and pressure control, and develop the related components.