•Efficiency up to 94% •Industrial-grade non-standard half-brick structure •NRTL, CE, and CB report certified
Select the Best Modules for Your Products
The AC-DC module series consist of modules with enclosures and encapsulated brick structures. It features small size, light weight, and high efficiency and reliability. The output voltage can be flexibly configured, adjusted in a wide range, and features high precision. It supports full-digital control, can be used in various scenarios such as telecom, industrial equipment and instruments.
Efficiency up to 96%
Small size with high power
Failure rate < 300 ppm
Supporting fault warning and black box functions
•96% peak efficiency •AC/HVDC input •CE, UL, TÜV, and CB report certified
•Efficiency ≥ 95% •I²C communication and current equalization •NRTL, TÜV, CQC, and CB report certified
The DC-DC module adopts the industry-leading topology, process technology, and isolated synchronous rectifier design. It features high efficiency, high density, and a wide input and output range, and supports remote enabling, switch control, and output voltage adjustment. It can be widely used in servers, storage devices, datacom and wireless communication devices, industrial devices, instruments, monitoring devices, and test devices.
Multiple outputs and simple design
Brick module series supporting up to 1500W
Efficiency up to 96%
Failure rate < 30 ppm
•Output voltage: 3.3V/5.5V/12V/23V/28V/50V •Standard 1/16, 1/8, 1/4 brick structure and non-standard 1.5 x 1/4 brick structure •High efficiency, high density, low output ripple and low noise
•Efficiency ≥ 94% •CAN communication for control and monitoring •CE, TÜV, UL, and CB report certified
The next-generation PSiP uses the industry-leading packaging technology to integrate the controller, MOS, inductor, capacitor and other circuits to implement high-density, high-frequency and compact size power supply. It effectively simplifies peripheral circuits, supports operation without commissioning and facilitates product miniaturization and fast development. It can be widely used in various scenarios, such as communications, servers, industry, rail transportation and automation.
Multi-layer structure for the controller, MOS, inductor, and capacitor
Simplified peripheral circuits and free of commissioning
Doubled density compared with discrete components
More than 130 million units shippment worldwide
•Efficiency up to 96.5% •Wide-range trim voltage adjustment and remote power-on/off •Surface-mounted package and SMT processing